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Back‑End Packaging & Test
OSAT, advanced packaging, and final test/handler investments.
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Latest in Back‑End Packaging & Test
Valmet to deliver new board making line for lightweight packaging to Anhui Linping
10+ hour, 4+ min ago (190+ words) The advanced technologies and lifecycle support included in the new delivery, combined with the experience gained from the previous project, will ensure reliable production while supporting Anhui Linping’s strategic targets. Valmet has previously delivered a complete board making line PM…...
PVA Introduces Large-Format Dispensing Platform for Oversized Assemblies
14+ hour, 21+ min ago (165+ words) HALFMOON, N.Y. — PVA has introduced a large-format automated dispensing and coating platform designed to accommodate larger assemblies and heavier process equipment while maintaining positioning accuracy. The DeltaFlex platform features a ruggedized gantry, dual-driven Y-axis, linear encoder positioning and high-speed motion capability....
Ten-Nine Technologies Partners with MIN N JUNE Chemical to Expand TENIX in South Korea
14+ hour, 20+ min ago (272+ words) How TENIX is blended with the Cathode active material Paige Johnson, CEO and founder, Ten-Nine Technologies Ten-Nine Technologies has partnered with MIN N JUNE Chemical to introduce and evaluate TENIX across South Korea’s advanced battery manufacturing sector. TULSA, OK, UNITED…...
Why mono-material pouches fail on high-speed lines
23+ hour, 21+ min ago (598+ words) Mono-material pouches can disrupt high-speed packaging lines when film properties and machine settings are poorly matched. A packaging line can run reliably with a conventional laminate, then start producing leaking seals, wrinkled film or rejected pouches after a switch to…...
Sidel to showcase latest packaging innovations at Gulfood Manufacturing 2026
18+ hour, 9+ min ago (229+ words) Taking place from 3 to 5 November at the Dubai World Trade Centre, Gulfood Manufacturing brings together food, beverage and consumer goods manufacturers to explore the latest developments in processing, packaging and production technologies. At Hall 3, Stand A3-4, Sidel will present solutions designed…...
Sumitomo Bakelite expands packaging material production across Singapore, China
17+ hour, 43+ min ago (116+ words) digitimes Sumitomo Bakelite expands packaging material production across Singapore, China Keep me signed in - Track financials & stock data of Taiwan tech. - Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues - TSMC 3nm, 2nm, and CoWoS stay tight…...
Valmet continues its partnership with Anhui Linping Circular Development with delivery of a new board making line for lightweight packaging
18+ hour, 27+ min ago (46+ words) TradingView Valmet continues its partnership with Anhui Linping Circular Development with delivery of a new board making line for lightweight packaging More news from PR Newswire...
According to Taiwan media Commercial Times, TSMC's advanced packaging - Shanghai Metals Market (SMM)
22+ hour, 16+ min ago (65+ words) According to Taiwan media Commercial Times, TSMC's advanced packaging Shanghai Metals Market [TSMC aims to start advanced packaging production in the U.S. in H1 2028] Data Source Statement: Except for publicly available information, all other data are processed by SMM based on publicly…...
Top Tinplate Manufacturer: Zhangjiagang Great Robust Advances Metal Packaging Solutions
19+ hour, 19+ min ago (700+ words) There were 451 press releases posted in the last 24 hours and 495,082 in the last 365 days. Tin Lid Ring Bottom Parts For companies sourcing tinplate, the objective is not simply to obtain steel sheets. It is to identify a material solution that…...
Nordson Electronics Solutions launches ASYMTEK Vantage XL fluid dispensing system for panel-level packaging
1+ day, 18+ min ago (215+ words) DQ Nordson Electronics Solutions launches ASYMTEK Vantage XL fluid dispensing system for panel-level packaging It is designed to meet throughput and yield demands driven by AI, high-performance computing, and advanced semiconductor packaging applications Nordson Electronics Solutions, a global leader in…...