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Dust Control & Filters
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Samsung Electronics sets AI memory strategy with HBM5, CXL, next-gen SSDs
32+ min ago (429+ words) Sim Ho-jun, executive director of the AE Team in the Memory Business at the Device Solutions (DS, semiconductor) institutional sector of Samsung Electronics, gave a presentation on the theme of "expanding innovation in the AI era," and set out three…...
DG Matrix Unveils Interport 360 SST and Interport OS for AI Factories Based on NVIDIA MGX
11+ hour, 9+ min ago (1005+ words) SAN JOSE, Calif., October 12, 2026--DG Matrix, the global leader in solid-state transformer solutions, today unveiled at the OCP Global Summit the technologies that make Interport™ 360 Flex. It’s a complete, skid-mounted power solution for modular datacenters and next-generation AI factories based…...
eir to begin retiring 3G network from 1 October
2+ week, 4+ day ago (214+ words) eir is reminding customers that from 1 October, 2026, it will begin retiring its 3G network across Ireland. The planned switch-off is part of eir’s ongoing mobile network evolution, supporting the continued development and enhancement of its 4G and 5G services. Donegal will be the…...
Taiwan's Nanya expects DRAM prices to climb further in Q4
2+ hour, 47+ min ago (1305+ words) IntelliNews...
Nvidia and Cisco develop USFP form factor: up to 12.8 Tb/s capacity
11+ hour, 9+ min ago (278+ words) Nvidia and Cisco are collaborating on Ultra-Dense Small Form Factor Pluggable (USFP), a new form factor for optical modules with 400 Gb/s per lane. According to the two companies, USFP delivers four times the bandwidth of current pluggables with 200 Gb…...
NVIDIA and Cisco launch USFP optics for 400Gb/s lanes to boost AI data center efficiency and scale.
10+ hour, 53+ min ago (311+ words) NVIDIA and Cisco have introduced Ultra-Dense Small Form Factor Pluggable (USFP), a new optical module supporting 400Gb/s per lane, enabling up to 12.8Tb/s capacity for AI data centers. This technology doubles bandwidth per lane and increases power efficiency, allowing AI…...
Larch Networks and Dorado to Showcase Commercially Available Ethernet AI Fabric and Orchestration at OCP Global Summit
3+ hour, 17+ min ago (235+ words) Larch Networks and Dorado to Showcase Commercially Available Ethe The National Law Review Larch Networks and Dorado to Showcase Commercially Available Ethernet AI Fabric and Orchestration at OCP Global Summit 10 switches running Larch Hardened SONiC and Dorado Cruz orchestrating and…...
Heilind Electronics Now Offering Molex VersaPower Connectors for High-Density, High-Current Board-to-Board Applications
12+ hour, 9+ min ago (458+ words) WBOC TV...
Celestica Introduces the DS6005 Data Center Switch with Co-Packaged Optics to Enable Power-Efficient AI Fabrics
3+ hour, 20+ min ago (423+ words) The Globe and Mail Celestica Introduces the DS6005 Data Center Switch with Co-Packaged Optics to Enable Power-Efficient AI Fabrics TORONTO, Oct. 12, 2026 (GLOBE NEWSWIRE) -- Celestica Inc. (NYSE: CLS) (TSX: CLS), a global leader in data center infrastructure and advanced technology solutions, today…...